Water cooling Liquid Cooled Plate Introduction

At present, with the development of the communication industry, especially 3G products, all the production, suppliers are at the same time encountered an IGBT (insulated gate bipolar transistor) heat dissipation problem, when the cavity IGBT heat dissipation can not be dissipated after the chip automatic protection, making the use of the frequency becomes below 85%, affecting the work efficiency, even more directly crash.

The way of the existing industry is the forced convection of fans and heat sinks this way, but the method is low efficiency, in the case of low power is OK, but high power IGBT inside is not desirable. So the best way is water-cooled liquid cooling plate heat dissipation, the traditional water-cooled liquid cooling plate generally adopts two processing methods:

(1) The channel flow channel is hollowed out between two copper or metal substrates, and then welded. This way it can leak very quickly under high pressure and fast water flow.

(2) Add a copper or aluminum tube in the middle of two copper or metal substrates, and then solder it together in the way of solder paste. This way can avoid the leakage problem, but the problem is that a welding medium will be formed between the aluminum or copper substrates. This has a thermal resistance difference, generally (0.3W /m°C), and a gap thermal resistance (0.LW /m°C), so that the greater the power between the temperature difference is also greater.